I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total Time above liquiduos? btw, we use SAC305 solderpaste. Thanks in advance for any input.
Craig
3/1/2017 9:14:09 PM
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3/1/2017 9:14:09 PM
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3/1/2017 9:14:09 PM
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ali.serbetci
3/1/2017 9:14:09 PM
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3/1/2017 9:14:09 PM
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