Soldering problem on BGA with SAC105 bump

2017/2/27 21:14:09

I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total Time above liquiduos? btw, we use SAC305 solderpaste. Thanks in advance for any input.

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Post Comment

Craig

2017/3/1 21:14:09

Thanks for marvelous posting.

Shahzad Rafiq

2017/3/1 21:14:09

Great work. I really appreciate it.

José luis cordoba

2017/3/1 21:14:09

Thanks for your intelligence. Pretty interesting and useful.

ali.serbetci

2017/3/1 21:14:09

Your post answered my questions. Thanks a lot.

Jeff Hanenkrat

2017/3/1 21:14:09

Nice content you’ve posted in here

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