Soldering problem on BGA with SAC105 bump

2/27/2017 9:14:09 PM

I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total Time above liquiduos? btw, we use SAC305 solderpaste. Thanks in advance for any input.

Craig

3/1/2017 9:14:09 PM

Thanks for marvelous posting.

Shahzad Rafiq

3/1/2017 9:14:09 PM

Great work. I really appreciate it.

José luis cordoba

3/1/2017 9:14:09 PM

Thanks for your intelligence. Pretty interesting and useful.

ali.serbetci

3/1/2017 9:14:09 PM

Your post answered my questions. Thanks a lot.

Jeff Hanenkrat

3/1/2017 9:14:09 PM

Nice content you’ve posted in here

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