Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We tried to increase the solder paste thickness & prolong the soaking time BUT solder wick did happen again. Then we change to Ag/Ni/Sn termination component,we got a good solder fillets. Can anyone tell us what is happening ?
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