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Does anyone have design knowledge of why some manufacturers remove solder resist from the area around pads on fine pitch devices? What purpose does it serve?
I only know that it would be better for AOI as you would not have light being reflected from the solder resist coating between soldered leads as it would be a matt finish if it was removed.
Pedro Skou
3/2/2017 6:59:16 PM
incredible work
Michele Baldin
3/2/2017 6:59:16 PM
incredible work
Luis Moreno
3/2/2017 6:59:16 PM
Bravo! Hope you can write soon.
Dana
3/2/2017 6:59:16 PM
Really appreciate your content. It quite benefits my learning and it has solved my puzzles completely. Thanks.