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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Solder Paste to Device (BGA) or PCB
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Solder Paste to Device (BGA) or PCB
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Adair

Can anybody tell me which is better; to paste to BGA or to paste to PCB? What are the pitfalls when pasting to BGA?
10 likes
2017/2/2 1:07:46
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Allen Litton

Remarkable.I have learned a lot from your post.
2017/2/4 1:07:46

ingcaschera

Pretty good and useful info for beginners.
2017/2/4 1:07:46

Mike

Bookmarked.Really helpful.
2017/2/4 1:07:46

Benjamin

I think you are a genuis. The idea in your post is quite helpful and lights me. I have been puzzled for a long time in my new project.
2017/2/4 1:07:46

Calvin

Excellent work. I am impressed.
2017/2/4 1:07:46
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