Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Solder Paste to Device (BGA) or PCB
Solder Paste to Device (BGA) or PCB
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Can anybody tell me which is better; to paste to BGA or to paste to PCB? What are the pitfalls when pasting to BGA?
Statement: This post is only the personal view of the author and does not represent the opinions of

Allen Litton

Remarkable.I have learned a lot from your post.


Pretty good and useful info for beginners.


Bookmarked.Really helpful.


I think you are a genuis. The idea in your post is quite helpful and lights me. I have been puzzled for a long time in my new project.


Excellent work. I am impressed.

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