We have found very small solder deposits on the gold fingers of some PCI boards after assembly at our CM. In the IPC-A-610, it says that no contamination or solder is allowed in the critical contact area.
1. I'm looking for feedback on what others are doing to mask the gold fingers through the SMT process, or are you doing something else to prevent solder on gold fingers.
2. Is anyone determining acceptability of a solder deposit on a gold finger by the size of the solder deposit? (e.g. 5 mil or smaller is acceptable)