My Message
Suggestions
We have found very small solder deposits on the gold fingers of some PCI boards after assembly at our CM. In the IPC-A-610, it says that no contamination or solder is allowed in the critical contact area.
1. I'm looking for feedback on what others are doing to mask the gold fingers through the SMT process, or are you doing something else to prevent solder on gold fingers.
2. Is anyone determining acceptability of a solder deposit on a gold finger by the size of the solder deposit? (e.g. 5 mil or smaller is acceptable)
Piero
2017/2/4 17:39:47
Interesting!
NGUYEN VAN HAI
2017/2/4 17:39:47
Truly enjyed reading your posts.
Carey
2017/2/4 17:39:47
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Bernard
2017/2/4 17:39:47
I think you are a genuis. The idea in your post is quite helpful and lights me. I have been puzzled for a long time in my new project.