Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > solder bridging under one corner of BGA
solder bridging under one corner of BGA
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Waelson Negreiros

Any one got experience on handling solder bridging under one corner of BGA?

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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Blithe

Please keep us up to date like this.

Andreas Jonsson

Very valuable!

Christever Rosario

Remarkable.

cgr-pcb

Like this post very much.

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