Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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solder bridging under one corner of BGA
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Waelson Negreiros

Any one got experience on handling solder bridging under one corner of BGA?

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Please keep us up to date like this.

Andreas Jonsson

Very valuable!

Christever Rosario



Like this post very much.

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