My Message
Suggestions
We've been experiencing solder balls on 0805 caps. We have modified the reflow profile and had some success, but some balling still persists. The balls always form from under the cap between the lands. I measured the distance between the lands at .031". Is this too small a distance? I tried the IPC land pad calculator and it actually said I could go even smaller. Is there a down side to increasing this distance aside from maybe creating a smaller zone for placement accuracy? If I go to .040" can I expect any reduction in solder balling between lands?
Account
Augus
2/4/2017 3:55:23 AM
Inictllgenee and simplicity – easy to understand how you think.
julien.brasart
2/4/2017 3:55:23 AM
Impressive and helpful.
Travis Kneale
2/4/2017 3:55:23 AM
Impressive
Carlos Ruiz
2/4/2017 3:55:23 AM
It help me a lot. Thank you.
Dimitri Tskhovrebadz
2/4/2017 3:55:23 AM
Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.