Problem: Mid chip solder balling.
Component affected: 0603 caps only
Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component).
As a containment I'll give a home plate design for the component but by standard we don't use home plate designs for 0603.
I'm seeing mid chip solder ball only at the location where there is a trace beneath the mask.
Any advice or suggestion for this peculiar case?