Are there anyone who can give me the answer about solder ball problem? We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. So when we print the other side , there are lots of bridge because of solder ball. PCB MAKER said we can not get rid of melted solder in the via hole during HAL process. Is it true or not. Do I have to make things to remove solderball under PCB automatically after one side soldering. I NEED YOUR EXPERIENCE.