I'm looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching solder balls to a BGA because were looking to apply them to leads, rather than a flat substrate/ board. Any help would be appreciated
Reply 2017-02-28 09:12:45
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