I'm looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching solder balls to a BGA because were looking to apply them to leads, rather than a flat substrate/ board. Any help would be appreciated
Bravo! Hope you can write soon.
Inictllgenee and simplicity – easy to understand how you think.