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I'm looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching solder balls to a BGA because were looking to apply them to leads, rather than a flat substrate/ board. Any help would be appreciated
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Beetlesmart
2017/3/2 9:12:45
Bookmarked.Really helpful.
Chao Yu
2017/3/2 9:12:45
Bravo! Hope you can write soon.
vitri.angelo
2017/3/2 9:12:45
Inictllgenee and simplicity – easy to understand how you think.