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Community > Groups > PCB Assembly Rule > SMTA China Presents Seven Best-Paper Awards
SMTA China Presents Seven Best-Paper Awards
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Giampaolo Braga

SMTA China announces that it presented awards for seven papers at the SMTA China South 2009 Conference Award Presentation Ceremony, held on Thursday, August 27, 2009 at the Shenzhen Ritz-Carlton Hotel in conjunction with the SMTA Hong Kong Chapter Annual Breakfast Reception.
Flextronics’ Jesus Tan was awarded The Best Paper of Technology Conference One for the paper titled “Technical Evaluation for Pallet Material Selection.”
Shenzhen Kaifa Technology Co., Ltd.’s Zuyao Liu was awarded The Best Presentation of Technology Conference One for the presentation titled “Influence of PBGA Thermo Warpage on Soldering Joints’ Reliability.”
iNEMI’s Haley Fu was awarded The Best Paper of Technology Conference Two for the paper titled “iNEMI HFR-Free Program Introduction.”
Martin Wen, from Indium Corporation’s Shenzhen Rep Office, received the award for The Best Presentation of Technology Conference Two for the presentation titled “Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly.”
Kyzen’s Phil Zhang was awarded The Best Paper of Vendor Conference One for his paper titled “White Residue on Printed Wiring Boards Post Soldering/Cleaning.”
Steve Glass, from RMD Instruments LLC, was awarded The Best Paper of Vendor Conference Two for his paper titled “Understanding XRF Technology and Clarification of its Application for Counterfeit Component Awareness and the RoHS Directive.”
Nobe Yan, of ICHIMURA - Shenzhen Kunqixinhua Technology Co., Ltd., was awarded Best Paper of Vendor Conference Three for “The Hazards of Tin Oxide Slag and Its Solutions.”

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