SMT of lead-free solder BGA on FR4 Ni-Au PCB

2017/2/28 10:14:13

I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate the IPC-7095 standard. I tried to find out which parameter in my process cause the void. I tried different solder paste(different brand, composition, even Pb/Sn), differnt reflow peak temp(220 to 260), different heating rate, duration above melting point, multiple reflow.....There are still voids in my every solder joint. And finally I even have voids in my lead-tin solder joint. This is really a big headache to me. Could anyone please help. I've almost tried everything I can. Thanks and every input are welcomed.


2017/3/2 10:14:13

It is very interesting and helpful.I will keep check your post.


2017/3/2 10:14:13

I like checking your post and hope your update comes soon.

Edward Chamberlain

2017/3/2 10:14:13

My favorite psot here. Its very impressive and helpful.

Jeff Hanenkrat

2017/3/2 10:14:13

Nice content you’ve posted in here

You might like


  • Threads


  • Following


  • Followers


PCB Prototype

PCB Instant Quote

x mm


Quote Now

PCB Assembly