SMT of lead-free solder BGA on FR4 Ni-Au

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In assembly the bare board is populated with electronic components, called a "printed circuit board assembly" (PCBA). In through-hole technology, the component leads are inserted in holes surrounded by conductive pads; In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB.

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SMT of lead-free solder BGA on FR4 Ni-Au PCB

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I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate the IPC-7095 standard. I tried to find out which parameter in my process cause the void. I tried different solder paste(different brand, composition, even Pb/Sn), differnt reflow peak temp(220 to 260), different heating rate, duration above melting point, multiple reflow.....There are still voids in my every solder joint. And finally I even have voids in my lead-tin solder joint. This is really a big headache to me. Could anyone please help. I've almost tried everything I can. Thanks and every input are welcomed.

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2017/2/28 10:14:13

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