Category:Electronic Components BGA

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BGA

SMT fine pitch or BGA component
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Laszlo Toth

Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the parts are removed from a tube/tray/tape for baking, what is the best option for storing them in the baking oven? For BGA's I would think placing them ball side up on a flat surface. What about QFQ's? Any manual handling will probably guarantee that lead coplanarity is compromised. If the leads must rest on a surface, what would be the best material to minimize contamination. I understand that any option is bad, I'm just curious how others handle such a situation.
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