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Hello everybody Good day My company is facing big problem with Chip drop after dipping I have analysis many case focus on 02 main cause 1. Handling process -> I would like to ask after glue bonding is abalibity drop. I test by force equipment that it is very difficult to drop after reflow 2. Very due by DIP machine. I check after Dip many chip drop. I wonder the glue not qualify I am using IR 130. Could you help me how to check the quality of glue IR 130 And the reflow profile how is suitable for it Thanks and best regards
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Paul K. McKneely
2/4/2017 1:11:19 PM
Helpful!
Burgess
2/4/2017 1:11:19 PM
I am a new beginner and looking for good info for study. The posted info is pretty good. I will share it with my friends.
Fabian
2/4/2017 1:11:19 PM
This post is perfect for what I need. Thanks!