SMT chip component drop after DIP

2017/2/2 13:11:19

Hello everybody Good day My company is facing big problem with Chip drop after dipping I have analysis many case focus on 02 main cause 1. Handling process -> I would like to ask after glue bonding is abalibity drop. I test by force equipment that it is very difficult to drop after reflow 2. Very due by DIP machine. I check after Dip many chip drop. I wonder the glue not qualify I am using IR 130. Could you help me how to check the quality of glue IR 130 And the reflow profile how is suitable for it Thanks and best regards