Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wave soldering process?
I am trying to create a continuous assembly process where SMT components for bottom side is cured and for top side is reflowed, and TH components are wave soldered selectively by using one type of board carriers without operators handling boards.
Is any assembly company doing this, assembling both sides of SMT and doing selective wave soldering for TH? My thoughts suggests that this is not possible. And this continuous process with one board carrier type only works with SMT and TH components on one side.