SMT adhesive printing

2017/2/2 0:22:20

I have a question regarding post cured property of SMT adhesive.

If after component placement, the epoxy dot gets compressed and bridges between the 2 pads, what would the impact on the circuitry? Would it pose risk for flux entrapment? Could the cured epoxy introduce any impedance to the circuit and lead to test failure?

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Post Comment

Raymond

2017/2/4 0:22:20

Really helpful.

Byron

2017/2/4 0:22:20

Excellent work. I am impressed.

Sotiris Katsis

2017/2/4 0:22:20

I am happy that you shared this helpful information with us.Please keep us up to date like this.

eakkarach

2017/2/4 0:22:20

Great help to my new project.

Waelson Negreiros

2017/2/4 0:22:20

Awesome post. Like it very much.

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