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I have a question regarding post cured property of SMT adhesive.
If after component placement, the epoxy dot gets compressed and bridges between the 2 pads, what would the impact on the circuitry? Would it pose risk for flux entrapment? Could the cured epoxy introduce any impedance to the circuit and lead to test failure?
Raymond
2/4/2017 12:22:20 AM
Really helpful.
Byron
2/4/2017 12:22:20 AM
Excellent work. I am impressed.
Sotiris Katsis
2/4/2017 12:22:20 AM
I am happy that you shared this helpful information with us.Please keep us up to date like this.
eakkarach
2/4/2017 12:22:20 AM
Great help to my new project.
Waelson Negreiros
2/4/2017 12:22:20 AM
Awesome post. Like it very much.