I am using selective soldering to dip soldering the connector pins to the PCB and would like to know your experience:
a) Is there a recommended dip or dwell time for the dip soldering? b) How do we improve the solder coverage in the TH? c) How to solve solder bridging or shorts?
For the flux monitoring system,
a) Have anyone use it and find it useful? b) How the system help us control the process? c) What is the trend in the control of flux spraying and drop jetting?
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