Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Samsung SM482 and BGA
Samsung SM482 and BGA
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Ive been using a Samsung sm482 for about 2 years and recently got the heads up that we will be getting a project soon with a BGA chip. Im wondering if anyone on here uses the SM482 for BGA and if so, can offer any advice. Feeling a little worried about it.
We will also be using a Manncorp MC1400 stencil printer for the solder stenciling
Thank you in advance for advice and help!!!!!
Statement: This post is only the personal view of the author and does not represent the opinions of

Paul Cunnane

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Very valuable!


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