Requirements for BGAs

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Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Requirements for BGAs Reply 2017-02-02 05:35:24

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Esteban

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Does anybody have information on the minimum spacing required between BGAs (i/o counts close to 696)to avoid damage during rework? Also, on the keep out requirements between CSPs (o.5 mm pitch); between CSPs and BGAs.

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Reply 2017-02-02 05:35:24

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