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BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Requirements for BGAs
Requirements for BGAs
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Esteban

Does anybody have information on the minimum spacing required between BGAs (i/o counts close to 696)to avoid damage during rework? Also, on the keep out requirements between CSPs (o.5 mm pitch); between CSPs and BGAs.
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