Reliability of BGA

Community Home
3178 Threads
7018 Posts
53 Groups

Category:Electronic Components BGA

Group Administrators: 1 | Group Member: 95 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Join Group

Thread Reply

Reliability of BGA Reply 2017-02-02 05:47:19

This Author Only Favorite Reply

320 views

5 comments

22 likes

Esteban

Leave A Message

Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.

22 likes

Likes

Reply 2017-02-02 05:47:19

Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.