REFLOW PROFILING

2/2/2017 2:01:02 PM

DEAR TECHNETTER'S, When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex. <90 sec ramp up to 150 degrees C. 60-90 sec in the soak zone. 60 +/- 15 sec in time above liquidus. This can be a large difference in the total time. Is there a target time we should look for in each zone. I would think the most critical time would be time above liquidus because of the intermetallic. Any additional information would be appreciated.

andrea.pirovano

2/4/2017 2:01:02 PM

Remarkable.Great help to my learning.

Richard Farrar

2/4/2017 2:01:02 PM

incredible work

reilhacpierre

2/4/2017 2:01:02 PM

Excellent work. I am impressed.

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alex

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