Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Recommended max board for BGA repair
Recommended max board for BGA repair
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ENRICO BORSETTI

Does anyone have suggestions or observations on what my maximum board temperature should be when doing BGA repairs on an SRT?
In other words, How hot is too hot?
Somebody set the bottom heater on our new BGA repair machine to blow at 275 C, and our boards are consistently reaching temperatures of 150+ during repair.
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