Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > re-columning?
re-columning?
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Dennis

Does anyone know of a source for salvaging column grid arrays with damaged columns (through bad handling or removed from a PCBA? Not reballing, but recoluming.
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Joe

Marvelous!

Bishop

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Ronnie Walker

Useful!

Florencia

Great thanks for your helpful info. Really useful.

don.pincott

I really appreciate your content.Good resource for new beginners.

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