re-columning? | ALLPCB

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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re-columning?

449

Dennis

Does anyone know of a source for salvaging column grid arrays with damaged columns (through bad handling or removed from a PCBA? Not reballing, but recoluming.

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2017/2/27 20:50:47

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