Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then processed through a reflow (oven). After reflow, the BGA is placed in water and the paper containing the balls is pulled away from the component, resulting in a reballed BGA.
Is this product available on the market or is it a proprietary type design ??
Any information pertaining to this item or any other suggestions on BGA re-balling made easy, would be greatly appreciated. If there are any posted articles that you could direct me too, just indicate a ball-park time frame of the posting and I will search it out .