Re-Balling BGA and BGA sockets

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Re-Balling BGA and BGA sockets

395

frmendozat

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then processed through a reflow (oven). After reflow, the BGA is placed in water and the paper containing the balls is pulled away from the component, resulting in a reballed BGA.

Is this product available on the market or is it a proprietary type design ??

Any information pertaining to this item or any other suggestions on BGA re-balling made easy, would be greatly appreciated. If there are any posted articles that you could direct me too, just indicate a ball-park time frame of the posting and I will search it out .

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2017/2/2 5:06:01

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