My Message
Suggestions
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then processed through a reflow (oven). After reflow, the BGA is placed in water and the paper containing the balls is pulled away from the component, resulting in a reballed BGA.
Is this product available on the market or is it a proprietary type design ??
Any information pertaining to this item or any other suggestions on BGA re-balling made easy, would be greatly appreciated. If there are any posted articles that you could direct me too, just indicate a ball-park time frame of the posting and I will search it out .
Brian
2/4/2017 5:06:01 AM
Remarkable.
Burton
2/4/2017 5:06:01 AM
Excellent work. I am impressed.
julien.brasart
2/4/2017 5:06:01 AM
Impressive and helpful.
joffrey.perez.jp
2/4/2017 5:06:01 AM
Great help to my new project.
dinotavone
2/4/2017 5:06:01 AM
An interesting post.