We are trying to benchmark processes being used for QFN rework and have broken them down in to:
1. Devices with outline package sizes 2. Devices with outline package sizes >= 3 x 3mm
Inputs would be appreciated!
2017/2/26 19:31:34
gigisi1
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PCB Assembly
SMT-Stencil
Components Sourcing
Darnell
2017/2/28 19:31:34
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Franco Lanza
2017/2/28 19:31:34
Excellent work. I am impressed.
Alain
2017/2/28 19:31:34
Remarkable.I have learned a lot from your post.
Santiago Gonzalez
2017/2/28 19:31:34
Very impressive posting. Thank you for your efforts.