We are trying to benchmark processes being used for QFN rework and have broken them down in to:
1. Devices with outline package sizes 2. Devices with outline package sizes >= 3 x 3mm
Inputs would be appreciated!
2/26/2017 7:31:34 PM
gigisi1
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Darnell
2/28/2017 7:31:34 PM
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Franco Lanza
2/28/2017 7:31:34 PM
Excellent work. I am impressed.
Alain
2/28/2017 7:31:34 PM
Remarkable.I have learned a lot from your post.
Santiago Gonzalez
2/28/2017 7:31:34 PM
Very impressive posting. Thank you for your efforts.