I know that pump stencil technology can be used to print adhesive on boards with TH components already placed and clinched, but what about solder paste? The production sequence goes like this: First the jumper wires are placed and clinched with an odd-form assembly cell, then the boards are inverted and run through an SMT line consisting of a dispenser, SMD mounters and reflow oven. With a dispenser we are able to deposit a sufficient amount of solder paste on the pads so that the clinched leads do get soldered, but it is slooow. The whole business of dispensing solder paste on a panel with lots of components really slows the line down. So I was wondering if the pump stencil technology could be applied to solder paste as well, in order to get a large lump of paste on the TH joints but without getting too much of it on the SMD pads.