What could be possible reasons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circular crack)where inter layer is connected to barrel. The PCB is 6 layers board, HASL finish and pass through 2 reflow soldering cycles and hand soldering. The vias are tented. Any clue where to look for reasons ?
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