World's Fastest PCB Manufacturing
My Message
Suggestions
Account

Get started now

Log In

or

Sign Up

My ALLPCB

My Orders Shipping Address Balance Account Settings My SNS Profile
0
  • Home
  • Instant Online Quote Alternate Text
    • PCB Instant Quote
    • PCB Assembly Quote
    • SMD-Stencil Quote
  • PCB Assembly
  • PCB Capabilities
  • Feedback
  • Resources
    • Sponsorship
    • PCB Softwares
    • Units Conversion
    • FAQ
  • About Us
    • About Us
    • Why Us
    • Contact Us
    • News
Log In Sign Up
  • Home
  • Instant Online Quote
    • PCB Instant Quote
    • PCB Assembly Quote
    • SMD-Stencil Quote
  • PCB Assembly
  • PCB Capabilities
  • Feedback
  • Resources
    • Sponsorship
    • PCB Softwares
    • Units Conversion
    • FAQ
  • About Us
    • About Us
    • Why Us
    • Contact Us
    • News
service@ALLPCB.com
Thank you very much for your valuable suggestion!
We will solve it as soon as possible!

PIP Technology Application in Lead-Free PCB

2017/1/27 11:57:32

With the improvement of technology and people's living level, people's requirement on electronic products have moved towards lightness, thinness, miniature, high performance and multiple functions so that miniature and integrity of electronic products have become the main direction of their development. In order to increase the density level of components, lots of single-side and double-side circuit boards primarily manifest surface mount components (SMCs) or surface mount devices (SMDs). However, in terms of intrinsic intensity, reliability and applicability, PIP components still hold more advantages than SMCs and SMDs in some cases, especially for edge connectors. For example, in double-side SMT (Surface Mount Technology) boards featuring mixed assembly with few PIP components on the top, application of PIP technology is helpful to process reduction and cost control. PIP technology is a printing method by template, that is, some amount of solder paste is printed on the surface of SMCs and on through holes and pads of through-hole mounted components. After the completion of mounting, soldering is completed after high-temperature oven.
Compared with traditional technology, PIP technology has the following advantages:
a. PCB fabrication and technology process is simplified owing to the absence of wave soldering.
b. Workshop space is saved due to fewer applications of needed equipment, material and workers.
c. PCB manufacturing cost is decreased while production cycle is shortened.
d. High defect rate caused by wave soldering can be avoided so that first pass yield can be improved.
e. One or more heat treatment steps can be omitted so that PCB solderability and component reliability will rise.
f. Thru-hole reflow (THR) technology is capable of reducing the amount of flux, avoiding the contamination of flux on PCB caused by wave soldering.

  • 2217
  • 1
  • 209
Post Comment

    dinotavone

    2017/1/29 11:57:32

    I am going to keep checking for new writings.

    You might like

    rayy2007

    • Threads

      6

    • Following

      0

    • Followers

      0

    PCB Prototype

    PCB Instant Quote

    x mm

    Quantity

    Quote Now

    PCB Assembly

    SMT-Stencil

    • 12
    Products & Service
    PCB Capabilities
    Aluminum PCB Service
    PCB Assembly Service
    SMT-Stencil
    Quotation & Feedback
    Online Auto-Quotation
    PCB Assembly Quote
    Quote by Salesperson
    Customer Reviews
    Customer Support
    FAQ
    Community
    Sponsorship
    Referral Program
    About Us
    About Us
    Why Us
    Contact Us
    News
    Resource Details
    PCB Software
    Units Conversion
    service@allpcb.com central_support@allpcb.com
    Follow Us:
    Facebook Youtube Twitter Tumblr Youtube
    Certification: Certification
    Our Preferred Partners: Our Preferred Partners

    Please send Gerbers to service@ALLPCB.com for quotation © ALLPCB.com,All Rights Reserved Privacy PolicySitemap

    Secure Site by GoDaddy.com This site has earned the McAfee SECURE certification.