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PCB Design Rules

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Initially PCBs were designed manually by creating a photomask on a clear mylar sheet, usually at two or four times the true size. Starting from the schematic diagram the component pin pads were laid out on the mylar and then traces were routed to connect the pads. If you have many questions of PCB Design, please come here!

Community > Groups > PCB Design Rules > PCB Design on Internal Thermal Dissipation
PCB Design on Internal Thermal Dissipation
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Fast development of electronic technology leads to instant improvement in terms of computational speed, computational frequency and integrity of electronic products. Besides, with the volume of electronic products shrinking, volumetric power density is becoming increasingly high. In addition, the development orientation of thickness, lightness and miniature all make electronic components feature increasing calorific value of unit volume. With the upgrading of electronic products, their reliability is badly influenced as a result of fast increasing density of heat flow in PCBs. According to 10 degree principles, each time temperature rises by 10 Degrees Celsius, part of parameters of some components will decrease by a half. Based on a research, 55% of electronic devices are damaged because the temperature bypasses rated value of components. Therefore, reasonable component layout and PCB thermal dissipation has been the main elements engineers must consider.

Statement: This post is only the personal view of the author and does not represent the opinions of

Thomas Cobb

What you share on your post is quite useful.

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