Parylene Coating and BGA Reliability

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Parylene Coating and BGA Reliability Reply 2017-02-28 15:30:53

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don.pincott

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Back in the mists of time there were two papers on the use of Parylene Coating and the improved thermal cycling results in 1990. It was on LCCC then shortly after on BGA. Does anyone know of results of recent trials or have a copy of the BGA papers.

I was interested specifically on 360plus tin/lead BGAs and increased life provided by the Parylene Coating and the coating thickness used.

Many thanks

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Reply 2017-02-28 15:30:53

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