Parylene Coating and BGA Reliability

Community Home
3200 Threads
7018 Posts
53 Groups

Category:Electronic Components BGA

Group Administrators: 1 | Group Member: 95 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Join Group

Thread Reply

Parylene Coating and BGA Reliability Reply 2017-02-28 15:30:53

This Author Only Favorite Reply

404 views

3 comments

24 likes

don.pincott

Leave A Message

Back in the mists of time there were two papers on the use of Parylene Coating and the improved thermal cycling results in 1990. It was on LCCC then shortly after on BGA. Does anyone know of results of recent trials or have a copy of the BGA papers.

I was interested specifically on 360plus tin/lead BGAs and increased life provided by the Parylene Coating and the coating thickness used.

Many thanks

24 likes

Likes

Reply 2017-02-28 15:30:53

Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.