Paper Reballing Preforms

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Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Paper Reballing Preforms Reply 2017-02-02 14:48:00

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Bowen

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Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those little preform remnants everywhere!

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Reply 2017-02-02 14:48:00

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