My Message
Suggestions
Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does anyone have experience with assembly using no clean with an underfill? Any comments or suggestions would be greatly appreciated.
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Livio
3/1/2017 6:50:08 PM
Marvelous!
Livio
3/1/2017 6:50:08 PM
Marvelous!
babinyecz
3/1/2017 6:50:08 PM
Glad to read such a marvelous article here. You are a genius.
yesyes
3/1/2017 6:50:08 PM
I was really confused, and this answered all my qutoiesns.