My Message
Suggestions
Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does anyone have experience with assembly using no clean with an underfill? Any comments or suggestions would be greatly appreciated.
Account
Livio
2017/3/1 18:50:08
Marvelous!
Livio
2017/3/1 18:50:08
Marvelous!
babinyecz
2017/3/1 18:50:08
Glad to read such a marvelous article here. You are a genius.
yesyes
2017/3/1 18:50:08
I was really confused, and this answered all my qutoiesns.