Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does anyone have experience with assembly using no clean with an underfill? Any comments or suggestions would be greatly appreciated.
Reply 2017-02-27 18:50:08
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