April 25, 2012 will witness the opening of NEPCON China 2012 at Shanghai World Expo Exhibition & Convention Center. As the largest event for the electronics manufacturing
and SMT industry across Asia, NEPCON China has become the weather vane for China’s industrial peers. Currently, 98% of booths for NEPCON China 2012 are sold out with almost all the world-leading SMT manufacturers and material suppliers scheduled to exhibit. NEPCON China 2012 covers an unprecedented area of 34,000 sq. m. With more than 1000 types of electronics manufacturing equipment, materials, test and measurement products, and related devices to be exhibited, it is expected to attract more than 500 exhibitors from 22 countries and regions, and over 18,000 industry leaders and buyers.
To keep in line with current and future trends, NEPCON China 2012 not only provides traditional exhibit sections for displaying electronics manufacturing products and materials, but also will open four new specialized sections, including ESD and Cleaning Room, Electronics Manufacturing Automation, Advanced Electronic Packaging and Touch Screen Manufacturing, to meet the exhibitors’ and visitors’ further needs and expectations for this platform. Additionally, an “EPA Zone” for introducing the best practicing example of ESD will be set up jointly by NEPCON and the Shanghai ESD Association, which will provide professional guidance for electronics manufacturing insiders. Moreover, a “Seminar on ESD Technology” will be held during the exhibition to establish a one-stop platform for professionals to share information.
NEPCON China 2012 will be extremely rewarding with both traditional SMT exhibits and newly-added sections. The following exhibits are worth special attention: world-leading electronic SMT equipment from Fuji, ASM and Panasonic; soldering ovens from Heller, BTU and Rehm Thermal; test and measurement equipments from Agilent, Omron, Teradyne and TRI; advanced e-manufacturing auto-tools from Kilews and Jia Si Jie; motion control equipment from YASKAWA, Nuo Yin (Hiwin’s Agent), IKO, NBK and Sumida (Yamaha’s Agent); soldering materials from Senju, Henkel and Indium; dispensing and coating equipment from Nordson ASYMTEK, Musashi and Saejong.
Various high-end industrial activities will be launched during the exhibition to cover in-depth discussions of various hot topics, including the current situation and future trends of industrial technology, electronics industry and manufacturing, automation and electronic packaging. Particularly, Reed Exhibitions and IPC will co-organize the Eastern China Welding Competition during NEPCON China, the most professional display platform for electronics manufacturing products around Asia. This competition will offer a stage for domestic welding operators to shine and thus promote the enhancement of China’s welding techniques.
NEPCON China 2012 will be held at Shanghai World Expo Exhibition & Convention Center (No. 111 Shiboguan Road, Pudong District). The venue is centrally located near the central position of the 2010 Shanghai World Expo region, along Huangpu River, on the west of Expo Axis and close to the China Pavilion, the World Expo Center and Expo Performance Center. The new expo center will provide NEPCON with advanced facilities, convenient transportation and complete functions to provide a unique and comfortable experience for China’s SMT companies, electronics manufacturers and overseas supporting organizations. This move also corresponds to NEPCON China’s long-term strategy to continuously meet the needs and demands of its exhibitors and visitors.
Green Lighting Shanghai 2012, a comprehensive stage for displaying research results of the entire LED lighting industry chain from materials, production testing equipments, production application to solutions, will be held simultaneously with NEPCON China 2012, to facilitate resource matching and sharing.