Thank you very much for your valuable suggestion! We will solve it as soon as possible!

PCB Industry Information

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Community > Groups > PCB Industry Information > Need help on Tomb Stoning
Need help on Tomb Stoning
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We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads are not the proper size. 1 end of each chip component will share a single test pad, the other ends of these chip components will be soldered to separate pads. Tomb stoning will result during automatic solder reflow unless the pads are trimmed to the proper size. The question is what should the relative size of these 3 pads be to eliminate tomb stoning. 1 pad will share 2 solder terminations, the other 2 pads will each have a single solder termination.
Thanks in advance for your expert advise.
Statement: This post is only the personal view of the author and does not represent the opinions of

Alessio Gandini

Very interesting post.




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An interesting post.


Have marked your post. Keep on your great job. Hope your next writing soon.

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