Thank you very much for your valuable suggestion! We will solve it as soon as possible!


Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > mirco bga stencil
mirco bga stencil
Alternate Text 315
Alternate Text 0
Alternate Text 11


Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing.
Statement: This post is only the personal view of the author and does not represent the opinions of


Good resource for new beginners.

Eric Flores Solis

Your article answered all my puzzles.


I must say you have very interesting posts here.


A good and help piece of info.

Barbara Seria

I am a new beginner and looking for good info for study. The posted info is pretty good. I will share it with my friends.

Hot Threads

New Threads