Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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mirco bga stencil Reply 2017-02-02 02:12:09
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Carey

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Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing.
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TOUFIK KENEF

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Good resource for new beginners.

Eric Flores Solis

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Your article answered all my puzzles.

Bernie

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I must say you have very interesting posts here.

pmaggi

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A good and help piece of info.

Barbara Seria

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I am a new beginner and looking for good info for study. The posted info is pretty good. I will share it with my friends.
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