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Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine specification needed? Thank you for your advise.
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Booth
3/2/2017 3:56:18 AM
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Mario1971
3/2/2017 3:56:18 AM
Marvelous!
Bert
3/2/2017 3:56:18 AM
Wow, these helpful info benefit me a lot. Great thanks to you.
Massimo Console
3/2/2017 3:56:18 AM
Your article answered all my puzzles.