Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. Do you have ever problems about pcb pads? please talk here.

Community > Groups > PCB Pad > Micro Vias in Pads
Micro Vias in Pads
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Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via?
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George Blat

Bookmarked.Really helpful.


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Very valuable!

Adrian Voroniuc

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