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Hi , The 4th stage in reflow soldering, the cool-down, I find is often over looked. A rapid cooling rate should give finer lead and tin structure with more bindings and thereby result in stronger solder joints. Can anybody give me some information concerning the recommended and maximum cooling rate. Thanks!
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fernando.eulate
3/3/2017 6:19:36 AM
I appreciate your article very much. Wait for your next writing.
Daniel
3/3/2017 6:19:36 AM
Perfect post that I need. Enjoy reading it.
Charlie Laub
3/3/2017 6:19:36 AM
Pretty good and useful info to my job. Keep on checking your post.
bruno.bellini
3/3/2017 6:19:36 AM
Quite useful and impressive info. I have learned a lot from your article and I will keep on reading your sharing.