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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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LF BGA Tests
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vitri.angelo

What kind of destructive testing is anyone doing for LF BGAs?
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John

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Alain

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Vratislav.michal

Useful!

henry.kjonsberg

Good resource for new beginners.

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