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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > LF BGA Tests
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LF BGA Tests
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vitri.angelo

What kind of destructive testing is anyone doing for LF BGAs?
27 likes
2017/2/27 1:36:36
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

John

I certainly enjoyed reading your post.
2017/3/1 1:36:36

unbreakablejb

Your article answered all my puzzles.
2017/3/1 1:36:36

Alain

You did a great job. Really appreciate your content.
2017/3/1 1:36:36

Vratislav.michal

Useful!
2017/3/1 1:36:36

henry.kjonsberg

Good resource for new beginners.
2017/3/1 1:36:36
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