hi, I am a research student in Electronics manufacturing at RIT. We are planning to assemble boards using lead free solder paste. I was wondering there be any changes in printing in using lead-free paste"Sn-3.9Ag-0.5Cu". The density of Sn-37Pb paste is 8.4 gm/cm3 and for lead free alloy the density is 7.4 gm/cm3. Would this change in density have any effect on printing.