We are implementing a high volume dedicated product line that will be doing lead free selective soldering. There seems to be 3 basic technologies. Wire fed (Panasonic Softbeam or Laser), solder pumps and chimneys (Pillarhouse, SEHO, ERSA, etc) and solder cups (Streckfuss, Inertec). We've only experienced the solder pump and chimney approach. Has anyone had experience with Streckfuss's machines? What about the Soft Beam? It seems that the Streckfuss machine would require very good natural solderability and wetting, the softbeam would overcome poor solderability, and the solder chimneys would be somewhere in the middle. Any advice would be greatly appreciated. Thanks
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