Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Lead-Free BGA Rework
Lead-Free BGA Rework
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ISA, s.r.o.

I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA warp up and doesn't allow me to get a good connection on the pads. I have tried using a larger nozzle, increased temperature, and nothing seems to work. the board is ENIG and it does contain a large ground plane.
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Francisco Javier

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Cleber Toss Hoffmann

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Rafael Mendoza

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Markus Schmitz

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