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I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA warp up and doesn't allow me to get a good connection on the pads. I have tried using a larger nozzle, increased temperature, and nothing seems to work. the board is ENIG and it does contain a large ground plane.
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Francisco Javier
2/4/2017 7:45:48 PM
You did a great job. Really appreciate your content.
Cleber Toss Hoffmann
2/4/2017 7:45:48 PM
I have share it with my classmates. They all appreciate it a lot.
Rafael Mendoza
2/4/2017 7:45:48 PM
This post is perfect for what I need. Thanks!
Calvin
2/4/2017 7:45:48 PM
Excellent work. I am impressed.
Markus Schmitz
2/4/2017 7:45:48 PM
It help me a lot. Thank you.