Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Lead-Free BGA Rework
Lead-Free BGA Rework
Reply
Alternate Text 391
Alternate Text 5
Alternate Text 6

ISA, s.r.o.

I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA warp up and doesn't allow me to get a good connection on the pads. I have tried using a larger nozzle, increased temperature, and nothing seems to work. the board is ENIG and it does contain a large ground plane.
6 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Francisco Javier

You did a great job. Really appreciate your content.

Cleber Toss Hoffmann

I have share it with my classmates. They all appreciate it a lot.

Rafael Mendoza

This post is perfect for what I need. Thanks!

Calvin

Excellent work. I am impressed.

Markus Schmitz

It help me a lot. Thank you.

Hot Threads

New Threads