Lead-free BGA in Tin/Lead Process

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Lead-free BGA in Tin/Lead Process

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markarice5

I am trying to assess current industry thinking on the question of whether or not lead-free BGAs (SAC or other) can or should be soldered in a tin/lead process. It seems there are differing opinions on this and I'm wondering what some of you are doing or your thoughts on the subject.

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2017/2/1 17:14:31

Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Boris

Remarkable.It help me a lot. Thank you.

2017/2/3 17:14:31

Worge

Your article answered all my puzzles.

2017/2/3 17:14:31

Eric Flores Solis

Your article answered all my puzzles.

2017/2/3 17:14:31

Barrette

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2017/2/3 17:14:31

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