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SMT Stencil

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The purpose of an SMT stencil is to transfer solder paste to a bare circuit board. Before the assembly of the SMT components solder paste is printed onto the component pads of the printed circuit board by stencil, which are today usually manufactured from steel, more rarely from nickel or polyimide.

Community > Groups > SMT Stencil > Kyzen Brings Fast-Drying Stencil Cleaning Solvent
Kyzen Brings Fast-Drying Stencil Cleaning Solvent
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Earl Swope

Kyzen announces plans to exhibit CYBERSOLV® C8882 at the SMTA Toronto Expo & Tech Forum, scheduled to take place Thursday May 15, 2014 at the Four Points By Sheraton Toronto Airport in Toronto, ON. C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes.
CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. The solvent dries quickly, eliminating the streaking and smearing experienced with traditional cleaning solvents. C8882 is non-flammable, removes all flux types, and does not interact with or remove nano-coatings.
CYBERSOLV® C8882 is available in one, five and 55 gallon containers as well as 16 ounce spray bottle containers and pre-saturated wipes.
Kyzen® and CYBERSOLV® are registered trademarks in the United States and other countries.
Kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. Kyzen’s industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. Founded in 1990, Kyzen is the leading provider of environmentally responsible, RoHS compliant cleaning chemistries to industries worldwide. For more information, please visit
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Mr. Atok Purnomo

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