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I think it is impossible because surface tension will prevent
solder from filling unplated vias especially small ones.
As FR4 material repells solder.
Of course you can. But assembling with wire is easier. The
trouble I suspect is heating both sides of the board
simultaneously such that you can get the solder to flow on
both sides, then overcoming the surface tension of the solder
and getting it to go through the hole.
To use solder is much faster than a wire. Imagine you have 100
or 200 vias which you have to fill. I think either way is OK
as long as the speed does not concern you.
Thanks for marvelous posting.
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