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PCB Equipments

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All of the pcb manufacturing equipments is supposed to provide high quality PCB assembly solutions for high mix, small to medium batch requirements.The manufacturing facilities should be continously invested to increase efficiency and maintain product quality.

Community > Groups > PCB Equipments > IR Rework Machine
IR Rework Machine
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Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following:
1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the package body, I am wondering how connections of bottom package would be reflowed.
2. Are there instances of solder splatter when removing BGA's? When picking up a reflowed component during removal, how do you prevent the weight of a pick up tip not pressing down on a component which can cause solder balls to form outside the package body or have solder flow into vias?
3. Can you rework microBGA or CSP measuring around 1mm x 1mm? Can the sensor / temperature probe that controls the heating process be reduced to a spot size small enough not to exceed the package dimension?
Statement: This post is only the personal view of the author and does not represent the opinions of

Jeff Hanenkrat

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Giovanni Pelliccioni

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