Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. Do you have ever problems about pcb pads? please talk here.

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IPC for pad spacing reduction
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Does the conductor spacing requirement in IPC-600G apply to pads? Does it include the nickel/gold finish or only the underlying copper?
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Really helpful.

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