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Component Learning

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Electronic components are basic electronic element or electronic parts usually packaged in a discrete form with two or more connecting leads or metallic pads. Electronic Components are intended to be connected together, usually by soldering to a printed circuit board (PCB), to create an electronic circuit with a particular function.

Community > Groups > Component Learning > Intel E7501 and P64H2 FC-BGA chips
Intel E7501 and P64H2 FC-BGA chips
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Dear All,
I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks. The reflow profile was set as follows
1) Ramp-up rate is 2.08C/Sec in average. 2) Soaking period is 84Sec from 150C to 183C. 3) Reflow duration above 183C is 100Sec, which includes 40Sec duration above 200C. 4) Ramp-down rate is less than 3C/Sec.
Anybody ever experienced a similar problem before? Any advise on the process?
Anyone here has the two chipsets' temperature data -- Peak withstand temperature and duration. -- Allowed reflow duration above 183C.
Thank you so much!
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Richard Baggaley

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