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Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time 60 to 90 sec. The question is there any metallic joint between the teminals of the component with the solder alloy. Please advice.
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Unai
2017/2/4 23:29:14
Pretty good and useful info for beginners.
Garry Thorn
2017/2/4 23:29:14
I have learned a lot from your article. Quite useful and impressive info.
Francisco Mesa
2017/2/4 23:29:14
A great sharing for beginners. Thanks for your efforts and I will follow you and keep reading your posts.
Ellis
2017/2/4 23:29:14
Really helpful.
Chad
2017/2/4 23:29:14
It was truly informative. Your post is very useful.Many thanks for sharing!