Hybrid reflow profile

2017/2/2 23:29:14

Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time 60 to 90 sec. The question is there any metallic joint between the teminals of the component with the solder alloy. Please advice.

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Post Comment

Unai

2017/2/4 23:29:14

Pretty good and useful info for beginners.

Garry Thorn

2017/2/4 23:29:14

I have learned a lot from your article. Quite useful and impressive info.

Francisco Mesa

2017/2/4 23:29:14

A great sharing for beginners. Thanks for your efforts and I will follow you and keep reading your posts.

Ellis

2017/2/4 23:29:14

Really helpful.

Chad

2017/2/4 23:29:14

It was truly informative. Your post is very useful.Many thanks for sharing!

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