With improvements in technology enhancing people’s lives, electronic products requirements have become greater in terms of being lighter, thinner, smaller, higher performance, and having more functionality. As a result, overall miniaturization and product integrity are the main focus of development among designers and manufacturers.
To increase the density level of components, lots of single- and double-sided circuit boards primarily manifest surface-mount components (SMCs) or surface-mount devices (SMDs). However, in terms of intrinsic intensity, reliability, and applicability, pin-in-paste (PIP) components in certain cases still hold more advantages than SMCs and SMDs, especially for edge connectors.
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